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| Deposition Sequence: | ||
| 1. Current collectors: dc magnetron sputtering. | ||
| 2. Cathode: rf magnetron sputtering or e-beam evaporation. | ||
| (3. Optional high temperature anneal to crystallize cathode.) | ||
| 4. Lipon electrolyte: rf magnetron sputtering of Li3PO4. | ||
| 5a. Lithium anode: evaporation of Li metal. (red path) | ||
| 5b. Li-ion anode: rf or dc magnetron sputtering of SnO2-SiO2, Sn, Zn or In. (yellow path) | ||
| 5c. "Li-free" anode: dc magnetron sputtering of current collector. (green path) | ||
| 6. Multilayer protective coating: rf magnetron sputtering of Li3PO4 or parylene + Ti deposition. |
Deposition Rates of Thin-Film Battery Components* |
|
Film |
Film Deposition Rate (Å/min) |
| Pt and Ni current collectors | 600 |
| Cathode | > 100 |
| Electrolyte, and overlayer for Li-free | > 100 |
| Lithium anode | 1800 |
| SiTON anode | 100 |
| Parylene + Ti Protective coating (each layer) | 900 |
*Sputter deposition rates for 2" diameter targets.
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Date revised - 3/23/2000 (njd) http://www.ssd.ornl.gov/BatteryWeb/PlanView.html